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Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC SOC CORTEX-M3 100MHZ 208QFP
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Base Product Number: |
A2F200 |
Product Status: |
Obsolete |
Peripherals: |
DMA, POR, WDT |
Primary Attributes: |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Series: |
SmartFusion® |
Package: |
Tray |
Mfr: |
Microchip Technology |
Supplier Device Package: |
208-PQFP (28x28) |
Connectivity: |
EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MCU, FPGA |
Package / Case: |
208-BFQFP |
Number of I/O: |
MCU - 22, FPGA - 66 |
RAM Size: |
64KB |
Speed: |
100MHz |
Core Processor: |
ARM® Cortex®-M3 |
Flash Size: |
256KB |
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Base Product Number: |
A2F200 |
Product Status: |
Obsolete |
Peripherals: |
DMA, POR, WDT |
Primary Attributes: |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Series: |
SmartFusion® |
Package: |
Tray |
Mfr: |
Microchip Technology |
Supplier Device Package: |
208-PQFP (28x28) |
Connectivity: |
EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MCU, FPGA |
Package / Case: |
208-BFQFP |
Number of I/O: |
MCU - 22, FPGA - 66 |
RAM Size: |
64KB |
Speed: |
100MHz |
Core Processor: |
ARM® Cortex®-M3 |
Flash Size: |
256KB |
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